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Three Dimensional System Integration: IC Stacking Process and Design Antonis Papanikolaou 2011 edition
Three Dimensional System Integration: IC Stacking Process and Design
Antonis Papanikolaou
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life.
246 pages, biography
| Media | Boeken Paperback Book (Boek met zachte kaft en gelijmde rug) |
| Vrijgegeven | 2 september 2014 |
| ISBN13 | 9781489981820 |
| Uitgevers | Springer-Verlag New York Inc. |
| Pagina's | 246 |
| Afmetingen | 155 × 235 × 14 mm · 394 g |
| Taal en grammatica | Engels |
| Uitgever | Papanikolaou, Antonis |
| Uitgever | Radojcic, Riko |
| Uitgever | Soudris, Dimitrios |