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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Way Kuo Softcover Reprint of the Original 1st Ed. 1998 edition
Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development
Way Kuo
420 pages, biography
| Media | Boeken Paperback Book (Boek met zachte kaft en gelijmde rug) |
| Vrijgegeven | 14 maart 2014 |
| ISBN13 | 9781461375968 |
| Uitgevers | Springer-Verlag New York Inc. |
| Pagina's | 420 |
| Afmetingen | 155 × 235 × 22 mm · 589 g |
| Taal en grammatica | Engels |