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More-than-Moore 2.5D and 3D SiP Integration Softcover reprint of the original 1st ed. 2017 edition
Riko Radojcic
More-than-Moore 2.5D and 3D SiP Integration Softcover reprint of the original 1st ed. 2017 edition
Riko Radojcic
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime.
182 pages, 58 Tables, color; 66 Illustrations, color; 2 Illustrations, black and white; XV, 182 p. 6
Media | Boeken Paperback Book (Boek met zachte kaft en gelijmde rug) |
Vrijgegeven | 4 mei 2018 |
ISBN13 | 9783319849324 |
Uitgevers | Springer International Publishing AG |
Pagina's | 182 |
Afmetingen | 285 g |
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