Vertel uw vrienden over dit artikel:
Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications Softcover reprint of the original 1st ed. 2015 edition
Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.
408 pages, 35 Tables, black and white; 269 Illustrations, color; 191 Illustrations, black and white;
| Media | Boeken Paperback Book (Boek met zachte kaft en gelijmde rug) |
| Vrijgegeven | 28 maart 2019 |
| ISBN13 | 9783319792552 |
| Uitgevers | Springer International Publishing AG |
| Pagina's | 408 |
| Afmetingen | 150 × 220 × 10 mm · 645 g |
| Taal en grammatica | Duits |
| Uitgever | Kada, Morihiro |
| Uitgever | Kondo, Kazuo |
| Uitgever | Takahashi, Kenji |