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Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity Zengtao Chen 2020 Edition
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Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity
Zengtao Chen
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
304 pages, 10 Tables, color; 44 Illustrations, color; 60 Illustrations, black and white; X, 304 p. 1
| Media | Boeken Paperback Book (Boek met zachte kaft en gelijmde rug) |
| Vrijgegeven | 19 september 2020 |
| ISBN13 | 9783030252038 |
| Uitgevers | Springer Nature Switzerland AG |
| Pagina's | 304 |
| Afmetingen | 233 × 155 × 26 mm · 482 g |
| Taal en grammatica | Duits |
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