Vertel uw vrienden over dit artikel:
Advanced Thermal Stress Analysis of Smart Materials and Structures Chen 1st ed. 2020 edition
Advanced Thermal Stress Analysis of Smart Materials and Structures
Chen
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
304 pages, 10 Tables, color; 44 Illustrations, color; 60 Illustrations, black and white; X, 304 p. 1
| Media | Boeken Book |
| Vrijgegeven | 19 september 2019 |
| ISBN13 | 9783030252007 |
| Uitgevers | Springer Nature Switzerland AG |
| Pagina's | 304 |
| Afmetingen | 150 × 220 × 20 mm · 641 g |
| Taal en grammatica | Duits |
Meer door Chen
Alles tonenMeer van dezelfde uitgever
Bekijk alles van Chen ( bijv. Book , Paperback Book , Hardcover Book , CD en CD/Merch )