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Direct Copper Interconnection for Advanced Semiconductor Technology
Direct Copper Interconnection for Advanced Semiconductor Technology
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
| Media | Boeken Paperback Book (Boek met zachte kaft en gelijmde rug) |
| Wordt vrijgegeven | 22 mei 2026 |
| ISBN13 | 9781032528403 |
| Uitgevers | Taylor & Francis Ltd |
| Pagina's | 448 |
| Afmetingen | 150 × 220 × 10 mm · 850 g |
| Uitgever | Shangguan, Dongkai |