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Wirebonding in Microelectronics (Set 2) Harman 3 Rev edition
Wirebonding in Microelectronics (Set 2)
Harman
Wire bonding is the attachment of fine wires from semiconductor chips to their substrates - a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. This title covers wire bonding advances for the era of super-small electronics.
| Media | Boeken Book |
| Vrijgegeven | 1 februari 2010 |
| ISBN13 | 9780071701013 |
| Uitgevers | McGraw-Hill Education - Europe |
| Afmetingen | 150 × 220 × 20 mm · 500 g (Gewicht (geschat)) |
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