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Benefiting from Thermal and Mechanical Simulation in Micro-electronics Softcover Reprint of the Original 1st Ed. 2000 edition
G Q Zhang
Benefiting from Thermal and Mechanical Simulation in Micro-electronics Softcover Reprint of the Original 1st Ed. 2000 edition
G Q Zhang
192 pages, biography
Media | Boeken Paperback Book (Boek met zachte kaft en gelijmde rug) |
Vrijgegeven | 3 december 2010 |
ISBN13 | 9781441948731 |
Uitgevers | Springer-Verlag New York Inc. |
Pagina's | 192 |
Afmetingen | 156 × 234 × 11 mm · 299 g |
Uitgever | Ernst, L.j. |
Uitgever | Leger, O.de Saint |
Uitgever | Zhang, G.q |
Bekijk alles van G Q Zhang ( bijv. Paperback Book )