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Hybrid Assemblies and Multichip Modules - Manufacturing Engineering and Materials Processing Kear 1e uitgave
Hybrid Assemblies and Multichip Modules - Manufacturing Engineering and Materials Processing
Kear
Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.
296 pages, 1, black & white illustrations
| Media | Boeken Hardcover Book (Boek met harde rug en kaft) |
| Vrijgegeven | 16 december 1992 |
| ISBN13 | 9780824784669 |
| Uitgevers | Taylor & Francis Inc |
| Pagina's | 296 |
| Afmetingen | 156 × 234 × 17 mm · 635 g |
| Taal en grammatica | Engels |