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Wafer Level 3-D ICs Process Technology - Integrated Circuits and Systems Chuan Seng Tan 2009 edition
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Wafer Level 3-D ICs Process Technology - Integrated Circuits and Systems
Chuan Seng Tan
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.
376 pages, 25 black & white tables, biography
| Media | Boeken Hardcover Book (Boek met harde rug en kaft) |
| Vrijgegeven | 19 september 2008 |
| ISBN13 | 9780387765327 |
| Uitgevers | Springer-Verlag New York Inc. |
| Pagina's | 410 |
| Afmetingen | 166 × 241 × 23 mm · 657 g |
| Taal en grammatica | Engels |
| Uitgever | Gutmann, Ronald J. |
| Uitgever | Reif, L. Rafael |
| Uitgever | Tan, Chuan Seng |
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